Body-tied, strained-channel multi-gate device and methods of manufacturing same

ABSTRACT

A fin-FET or other multi-gate transistor is disclosed. The transistor comprises a semiconductor substrate having a first lattice constant, and a semiconductor fin extending from the semiconductor substrate. The fin has a second lattice constant, different from the first lattice constant, and a top surface and two opposed side surfaces. The transistor also includes a gate dielectric covering at least a portion of the top surface and the two opposed side surfaces, and a gate electrode covering at least a portion of the gate dielectric. The resulting channel has a strain induced therein by the lattice mismatch between the fin and the substrate. This strain can be tuned by selection of the respective materials.

PRIORITY CLAIM

The present application claims priority to and is a continuationapplication of U.S. patent application Ser. No. 11/483,906, now U.S.Pat. No. 8,946,811, filed Jul. 6, 2006, and entitled “Body-TiedStrained-Channel Multi-Gate Device and Methods of Manufacturing Same,”which application in incorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to multi-gate transistorstructures and more specifically to a multi-gate transistor having astrained channel region.

BACKGROUND

Multi-gate structures are known in the art and are increasingly employedbecause of the advantageous features of scalability, drive currentimprovement, and switching speed, among others. Double gate transistors,triple gate transistors, omega transistors, and fin-FET transistors areamong the multi-gate structures that have been proposed and that arefinding increased acceptance.

Typically, multi-gate structures are formed on a so-called silicon oninsulator (SOI) substrate. This is because multi-gate transistors aregenerally formed on mesa or island structures. These mesas or islandsare preferably highly electrically isolated to prevent noise and crosstalk, and the SOI substrate readily lends itself to this process.

Recently, a so-called body-tied multi-gate structure has been proposedby Park et al., Fabrication of Body-Tied FinFETs (Omega MOSFETs) UsingBulk Si Wafers, 2003 Symposium on VLSI Technology Digest of TechnicalPapers, which article is incorporated herein by reference. Park et al.describe a multi-gate structure that is formed on a bulk silicon wafer.Advantageously, bulk wafer processing provides cost savings over themore expensive SOI wafers. Additionally, tying the transistor body tothe bulk substrate also provides improved thermal dissipation andimproved grounding and, hence, improved noise reduction.

While the prior art devices show improvement over planar transistors,further improvement in device performance is still needed. One suchimprovement is described herein.

SUMMARY OF THE INVENTION

In one aspect, the present invention provides for a fin-FET transistor.The transistor comprises a semiconductor substrate having a firstlattice constant, and a semiconductor fin extending from thesemiconductor substrate. The fin has a second lattice constant,different from the first lattice constant, and a top surface and twoopposed side surfaces. The transistor also includes a gate dielectriccovering at least a portion of said top surface and said two opposedside surfaces, and a gate electrode covering at least a portion of saidgate dielectric.

In another aspect, the present invention provides for an integratedcircuit. The integrated circuit includes a semiconductor substratehaving a top surface with a first lattice constant, and an insulatingfilm on said top surface of said semiconductor substrate. A plurality ofislands extends from said top surface of the semiconductor substrate.The islands have a second lattice constant that is different from thefirst lattice constant, the islands further extend above a top surfaceof the insulating film. The integrated circuit also includes at leastmulti-gate FET device. The multi-gate device includes a gate dielectricoverlying a portion of at least one of the plurality of islands, andgate electrode overlying the gate dielectric.

In yet another aspect, the present invention provides for a method ofmanufacturing a transistor. The method provides a substrate having a topsurface, the top surface having a first lattice constant, and forming aninsulating layer over the top surface. The method further providesforming an opening in the insulating layer to expose a portion of thetop surface, and epitaxially growing an extension on the top surface inthe opening. The extension has a second lattice constant that isdifferent from the first lattice constant. The method further providesforming a doped region in the extension, forming a gate dielectric overat least a portion of extension, and forming a gate electrode over thegate dielectric.

An advantageous feature of the invention is the ability to tune thestrain in the channel of the multi-gate transistor, by stress arisingfrom the interface between the underlying substrate and islandsextending therefrom.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIGS. 1 a through 1 e illustrate steps in the manufacture of a firstillustrative embodiment multi-channel transistor of the presentinvention;

FIGS. 2 a through 2 f illustrate steps in the manufacture of a secondillustrative embodiment multi-channel transistor of the presentinvention;

FIGS. 3 a through 3 f illustrate steps in the manufacture of a thirdillustrative embodiment multi-channel transistor of the presentinvention;

FIGS. 4 a through 4 e illustrate steps in a first illustrativemanufacturing process for an integrated circuit including embodiments ofthe present invention;

FIGS. 5 a through 5 e illustrate steps in a first illustrativemanufacturing process for an integrated circuit including embodiments ofthe present invention;

FIG. 6 illustrates an illustrative integrated circuit including amulti-gate transistor embodying aspects of the invention and a planartransistor; and

FIG. 7 schematically illustrates the distribution of strain across anillustrative transistor fin structure.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the preferredembodiments and are not necessarily drawn to scale. In fact, certainfeatures of the illustrations are exaggerated in relative size in orderto more clearly illustrate those and other features. To more clearlyillustrate certain embodiments, a letter indicating variations of thesame structure, material, or process step may follow a reference number.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of the presently preferred embodiments arediscussed in detail below. It should be appreciated, however, that thepresent invention provides many applicable inventive concepts that canbe embodied in a wide variety of specific contexts. The specificembodiments discussed are merely illustrative of specific ways to makeand use the invention, and do not limit the scope of the invention.

FIG. 1 a illustrates an intermediate structure in the manufacture of afirst illustrative embodiment body-tied, strained-fin device. While theillustrative embodiments illustrate fin-FET devices, one skilled in theart will recognize that the present invention is applicable to othermulti-gate transistors as well. At the step in the process illustratedin FIG. 1 a, a substrate 2 is provided upon which an oxide layer 4 and anitride layer 6 over oxide layer 4 have been formed. In the illustrativeembodiment, substrate 2 is a conventional p-type bulk silicon wafer.

Oxide layer 4 is preferably formed by chemical vapor deposition (CVD),thermal oxidation, or other conventional oxide deposition techniques.Oxide layer 4 is preferably at least 50 Å thick and more preferablybetween about 100 Å and about 300 Å in thickness.

Nitride layer 6 may be formed by conventional deposition techniques,such as CVD, plasma enhanced chemical vapor deposition (PECVD), and thelike. In the illustrative embodiment, it is desirable that the combinedthickness of oxide 4 and nitride 6 ranges between about 500 Å and about1,000 Å, depending upon the desired height of the subsequently formedfin, as will be discussed below. In the illustrative embodiments inwhich oxide 4 ranges from about 100 to 300 Å, nitride 6 will range fromabout 200 to 400 Å (for a 500 Å fin) and from about 700 to 900 Å (for a1,000 Å fin).

As shown in FIG. 1 a, nitride 6 and oxide 4 have been patterned, using aphotoresist layer (not shown) and conventional photolithographyprocesses. Nitride 6 is anisotropically etched, using e.g., conventionaldry etching techniques, followed by an anisotropic etch of oxide 6,using e.g., plasma etch. The patterning and etching of oxide 4 andnitride 6 form a trench 8 and expose the top surface of underlyingsubstrate 2. For clarity, only one trench is shown in oxide 4 andnitride 6. One skilled in the art will recognize that a plurality (infact, millions) of such trenches will be formed in a typical integratedcircuit on a typical wafer.

Silicon germanium (SiGe) is next epitaxially grown on the exposedsurface of substrate 2, filling trench 8, as shown in FIG. 1 b. Thisepitaxially grown SiGe will form a fin 10 of the resulting fin-FETtransistor, as will be explained in greater detail below. The variousmethods and processes for epitaxially growing SiGe fin 10 will beevident to one skilled in the art and are matters of design choice. Forexample, a typical SiGe alloy could be formed by a decomposition ofapproximately 20 sccm of dichlorosilane (SiH₂Cl₂) approximately 50-150sccm of one percent hydrogen diluted germane (GeH₄) at a temperature ofbetween 550° C.-750° C. and a pressure of approximately 10-200 torrs.Fin 10 is preferably grown to a height of from about 500 Å to about1,000 Å. This is the reason why the combined thickness of oxide 4 andnitride 6 is preferably about 500 Å to about 1,000 Å. In the figure, fin10 is grown to be substantially coplanar with the top surface of nitride6. In other embodiments, fin 10 may grow slightly above the top surfaceof nitride 6, although care must be taken that epitaxial growth does notspread out laterally over the top surface of nitride 6. In yet otherembodiments, epitaxial growth of fin 10 ceases prior to fin 10 reachingthe top of trench 8. These are design choices that can be establishedwith routine experimentation.

A crystal lattice mismatch occurs at the interface between SiGe fin 10and substrate 2. This lattice mismatch causes stress and applies astrain on fin 10. The lattice mismatch also causes strain in substrate2, but that strain is not significant for the purposes of theillustrative embodiments of the present invention. As is known in theart, stress improves charge carrier mobility in a crystallinesemiconductor device. More particularly, the lattice mismatch betweensubstrate 2 and SiGe fin 10 results in bi-axial compressive strain inSiGe fin 10. Compressive strain improves hole mobility in p-typedevices. This ability to engineer strain in the thin fin provides asignificant advantageous feature over the prior art.

Continuing to FIG. 1 c, nitride layer 6 is removed, such as by a wet ordry etch. The particular etch chemistry and process is a matter ofdesign choice. The main constraint on the etch process is that it hashigh selectivity to silicon nitride, relative to underlying siliconoxide layer 4. It is desirable that silicon oxide layer 4 not besignificantly attacked during the removal of silicon nitride layer 6.The removal of nitride layer 6 could be done, for instance, by using thephosphate (H₃PO₄) at a temperature of approximately 80-120° C. (a “wetetch” process). Removing nitride layer 6 exposes the top surface andportions of the sidewalls of fin 10. At this stage, appropriateimpurities can be implanted into fin 10. For instance, fin 10 can bedoped with either p-type or n-type impurities to establish a desirednominal impurity concentration. Alternatively, fin 10 can be doped insitu by introducing appropriate impurities at the desired concentrationduring the epitaxial growth process. Source and drain regions can thenbe implanted, as is known in the art.

As shown in FIG. 1 c, a silicon cap layer, or sacrificial layer, 12 isformed on the exposed surfaces of fin 10. This sacrificial layer ispreferably epitaxially grown. Because the silicon will epitaxially growon the exposed SiGe regions, but not on the exposed surface of oxidelayer 4, the epitaxial growth of polysilicon cap layer 12 isself-aligned. In the illustrative embodiments, in which a gate oxide often to twenty angstroms is desired, sacrificial cap layer 12 is grown toabout five to ten angstroms.

As illustrated in FIG. 1 d, cap layer 12 is converted to silicon oxidelayer 14 by exposing cap layer 12 to an oxidizing environment, such as asteam environment. Silicon cap layer 12 combines with oxygen to formsilicon oxide layer 14 (layer 14 will sometimes be referred to as a gatedielectric layer 14), which will serve as the gate dielectric for asubsequently formed fin-FET transistor. An advantageous feature of caplayer 12 is that it prevents SiGe fin 10 from oxidizing. Oxidation ofSiGe fin 10 would cause a re-distribution of the germanium atoms withinfin 10, which is undesirable. It is also undesirable to have Geimpurities in the gate dielectric.

Finally, as shown in FIG. 1 e, a gate electrode 16 is formed over gatedielectric layer 14 and surrounding oxide layer 4. In the illustrativeembodiment, gate electrode 16 comprises polysilicon. Gate electrode 16can be deposited and doped in situ or can be deposited undoped andsubsequently doped via ion implantation or other known techniques.

In an alternative embodiment, gate dielectric 14 can be formed of a highdielectric constant (high k) material rather than SiO₂. Materials suchas HfO₂, HfSiO can be employed, as can metal oxides and/or metalsilicates of e.g., hafnium, aluminum, zirconium, lanthalum, and thelike.

Likewise, in an alternative embodiment, and particularly when a high-kdielectric material is used, gate electrode 16 could be formed of metal,in lieu of polysilicon. One exemplary metal material is TaC, althoughother materials, including metals (Ta, Ti, Ru, Mo, etc.), metal alloys,metal nitrides (TaN, TiN, Mo₂N, etc.), metal carbides (TaC, etc.), andconducting metal oxides (RuO₂, etc.) and the like, could also beemployed for the gate electrode.

FIGS. 2 a through 2 f illustrate another exemplary embodiment. In thisembodiment, as shown in FIG. 2 a, substrate 2 comprises threesub-components. The first component is a silicon wafer 1 a, typically aconventional p-type bulk silicon wafer. Buffer layer 3 is formed atopsilicon wafer 1. A relaxed SiGe layer 5, having perhaps ten to thirtypercent concentration of Ge, is formed atop buffer layer 3. Buffer layer3, as the name implies, serves as to buffer, or ameliorate, the effectsof lattice mismatch between silicon wafer 1 and relaxed SiGe layer 5.Buffer layer 3 accomplishes this by having a germanium concentration ofessentially nil at the interface with silicon wafer 1—meaningessentially no lattice mismatch between layers 1 and 3, and a germaniumconcentration that essentially matches the germanium concentration ofrelaxed SiGe layer 5—meaning essentially no lattice mismatch betweenlayers 3 and 5. The germanium concentration gradually increases as oneproceeds from the bottom of buffer layer 3 (near the silicon wafer 1interface) to the top of buffer layer 3 (near the relaxed SiGe layerinterface). By virtue of this gradient in concentration, the effects ofthe lattice mismatch are virtually eliminated, or at least substantiallyreduced. In this way, SiGe layer 5 is not affected by the latticemismatch with silicon wafer 1.

In the illustrative embodiments, buffer layer 3 is thick enough so thatdislocations 7 arising at the buffer 3/SiGe layer 5 interface do notpropagate completely through the layer. In the illustrative embodiments,buffer layer 3 has a thickness ranging from about 5,000 Å to about10,000 Å. Relaxed SiGe layer 5 preferably has a thickness ranging fromabout 2,000 Å to about 3,000 Å. The resulting structure, as illustratedin FIG. 2 a, provides a “virtual” SiGe substrate upon which devices canbe fabricated.

As shown in FIG. 2 b, processing continues in a manner similar to thatillustrated in FIG. 1 a. Oxide layer 4 and nitride layer 6 are formedand patterned to form trench 8, as has been previously discussed. As adesign consideration, thermal budget should be kept in mind when formingoxide 4, nitride 6, and in subsequent process steps. This is becauseexceeding a thermal budget may result in degradation of the desirableproperties of SiGe layer 5 including, in some cases, a relaxation of thestress developed between SiGe layer 5 and Si fin 20 (discussed belowwith reference to FIG. 2 c). Process temperatures not exceeding rangefrom about 700 C to about 800 C are preferable for maintaining asatisfactory thermal budget. In this embodiment, the substrate exposedat the bottom of trench 8 is SiGe layer 5. For simplicity ofillustration, silicon wafer 1 is not illustrated in FIG. 2 b and theremaining figures.

Continuing on to FIG. 2 c, fin 20 is epitaxially grown on the exposedsurface of SiGe layer 3 at the bottom of trench 8, filling trench 8. Inthis embodiment, wherein the underlying substrate (layer 3) is SiGe, fin20 comprises Si. In this way, a lattice mismatch is again created at theinterface between silicon fin 20 and underlying SiGe substrate 3.Because SiGe has a larger lattice constant than Si, a biaxial tensilestrain is imposed on Si fin 20. Tensile strain tends to improve theelectron carrier mobility of n-type transistors, so this embodiment isparticularly well suited for n-type fin-FETs.

As illustrated in FIG. 2 d, processing continues with the removal ofnitride layer 6, similar to the process discussed above with referenceto FIG. 1 c. For simplicity of illustration, buffer layer 3 is not shownin FIG. 2 d or the following figures. In this embodiment, there is noneed for a sacrificial Si cap layer to be formed on Si fin 20. Rather,and as shown in FIG. 2 e, gate dielectric 14 can be formed directly onSi fin 20, such as by thermally growing gate dielectric 14 on theexposed surfaces of fin 20. One skilled in the art will recognize thatsome part of Si fin 20 will be consumed in the process of growing gatedielectric 14. This can be compensated for by nominally designing fin 20height and thickness to accommodate the loss due to formation of gatedielectric 14.

Finally, and as shown in FIG. 2 f, gate electrode 16 is formed atop gatedielectric 14 and the surrounding oxide layer 4. As explained above withreference to FIG. 1 e, gate conductor 16 may comprise polysilicon, oralternatively may comprise a metal, metal alloy, or conductive metalnitride or metal oxide. Likewise and as also explained above withreference to the embodiment illustrated in FIG. 1 e, gate dielectric mayalternatively be formed of a high-k dielectric such as HfO₂, HfSiO, orother well-known alternatives.

Yet another illustrative embodiment is illustrated in FIGS. 3 a through3 f. In this embodiment, as shown in FIG. 3 a, substrate 2 comprises asilicon wafer 1, a buffer layer 9, and a relaxed SiC layer 11. In thiscase, buffer layer 9 has a carbon concentration that varies from nearnil at the bottom (at the interface with silicon wafer 1) to aconcentration equivalent to that contained in relaxed SiC layer 11 (atthe interface with that layer).

As shown in FIG. 3 b, oxide layer 4 and nitride layer 6 are formed overSiC layer 11, using processes such as described above. Next, oxide layer4 and nitride layer 6 are patterned, also such as described above, toform trench 8. In this embodiment, trench 8 exposes underlying SiC layer11. As shown in FIG. 3 c, trench 8 is filled with epitaxially grownsilicon, much as described above with reference to FIG. 2 c, to form fin20. In this embodiment, Si fin 20 is grown upon underlying SiC layer 11.As is known, SiC has a lesser lattice constant than does silicon. Thismeans that a biaxial compressive stress arises at the interface of SiClayer 11 and Si film 20, resulting in a compressive strain in fin 20.This compressive strain enhances hole mobility and, hence, isparticularly beneficial when forming p-type MOSFETs.

Continuing on to FIG. 3 d, nitride layer 6 is removed, exposing Si fin20 and underlying oxide layer 4. Next, Si fin 20 is exposed to anoxidizing environment, wherein a portion of the top surface and exposedsidewalls of Si fin 20 are converted to silicon oxide. This processforms gate dielectric 14, as illustrated in FIG. 3 e. Polysilicon gateelectrode 16 is deposited over gate dielectric 14, as shown in FIG. 3 f.As in the prior described embodiments, gate dielectric 14 mayalternatively be a high-k dielectric and gate electrode 16 mayalternatively comprise a metal, metal alloy, metal nitride, or metaloxide.

Employing the materials and processes described above, it is envisionedthat localized strain in the range of up to 500 MPa to 1,000 MPa isachievable. As a potential design constraint, however, it should berecognized that the strain imposed on fin 10, 20 is greatest at theinterface with underlying layer 2, 5, or 11. The further from theinterface, the lesser the imposed strain. The phenomenon is illustratedschematically in FIG. 7, which illustrates a highly magnified view of aportion of FIG. 1 e. Fin 10 is shown, and superimposed on fin 10 arestrain lines 25. These strain lines schematically illustrate therelative magnitude of strain imposed on fin 10. Areas where the strainlines are highly dense (closely spaced) illustrate areas of high strain,whereas areas where the strain lines are less dense (spaced apart)illustrate areas of relatively lower strain. As schematicallyillustrated, the strain imposed on fin 10 (and analogously on fin 20 inthe other embodiments), is the highest at the interface with theunderlying layer and steadily decreases as the distance from theinterface increases. This phenomenon imposes a practical limit on theheight h of fin 10 (and analogously fin 20) of no more than perhaps 500Å to 1,000 Å, using presently available processes and materials. This isa practical limitation on present embodiments, but should not beconsidered as a limitation on the application or teaching of the presentinvention—it being envisioned that the current invention will beapplicable to future developed materials and processes.

Various other combinations of materials can be employed in forming thesubstrate and fin. Depending upon the desired strain in the fin, one canemploy a substrate/fin combination of Si/SiGe, SiGe/Si, SiC/Si, Si/SiC,or other combinations. The combinations are not limited to theabove-described materials. In fact, any Group III, Group IV, or Group Velement that can be introduced into the silicon lattice and change thelattice constant could be employed. Design constraints such as cost,ease of manufacturing, potential contamination concerns, and the like,are the only limitations.

In the illustrated embodiments, only a single fin 10, 20 is shown. Oneskilled in the art will recognize that millions of fins are likely to beformed on a single wafer and, in fact, in a single integrated circuit.As was discussed above, certain fin/substrate combinations producecompressive strain and, hence, are particularly advantageous forimproving carrier mobility in p-type devices, whereas otherfin/substrate combinations produce tensile strain in the fin and, hence,are particularly advantageous to improve carrier mobility in n-typedevices. It may be advantageous, therefore, to employ different finstructures in a single integrated circuit for the different transistortypes (n-type, p-type), particularly when employing so-called CMOStechnology.

One approach to accommodating CMOS devices is shown in FIGS. 4 a through4 e. FIG. 4 a illustrates substrate 2 upon which oxide 4 and nitride 6have been formed. Trenches 8 a and 8 b have been formed, as describedabove. For simplicity of illustration, only two such trenches are shown.Also not shown, are the various well regions, isolation structures,noise isolation rings, and other features commonly formed in substrate2. Photoresist material 30 has been formed and patterned, leaving firsttrench 8 a covered and second trench 8 b exposed. Silicon germanium isthen epitaxially grown on the exposed surface of Si substrate 2 at thebottom of trench 8 b, filling trench 8 b to form SiGe fin 10 b, as shownin FIG. 4 b. Optionally, fin 10 b can be implanted with n-typeimpurities at this point to form source and drain regions (not shown).No extra mask step is required, as fin 10 a has not yet been formed, andtrench 8 a is covered by photoresist 30.

Also shown in FIG. 4 b, photoresist 30 is stripped off, re-applied, andre-patterned such that fin 10 b is covered and trench 8 a is exposed.Then, silicon carbide is epitaxially grown in trench 8 a on the exposedsurface of underlying substrate 2, filling trench 8 a to form fin 10 a.Fin 10 a can then be implanted with appropriate p-type impurities toform source and drain regions. This is preferably done while fin 10 b isprotected by photoresist 30, although the relative doping concentrationscould alternatively be adjusted such that fin 10 b is heavily enoughdoped with n-type impurities so that source/drain regions of fin 10 bremain n-type, even after p-type counter doping. Photoresist 30 is thenstripped off, followed by removal of nitride layer 6 and the formationof silicon cap layers 12 a and 12 b, as shown in FIG. 4 c.

The device is then exposed to an oxidizing environment to convertsilicon cap layers 12 a, 12 b to gate oxides 14 a, 14 b, respectively,as shown in FIG. 4 d. Next gate electrodes 16 a and 16 b are formed andpatterned. In the illustrated embodiment, a substrate had grown thereonboth SiC fins and SiGe fins to achieve the desired strained fin.Alternatively, a SiC or SiGe virtual substrate could have grown thereonSi or other material fins for strain engineering. The respectivematerials chosen are a matter of design choice and routineexperimentation.

FIG. 4 e schematically illustrates in plan view the structure shown incross-sectional view in FIG. 4 d. A p-type fin-FET is provided by fin 10a, which has n-type source/drain regions 32 implanted at its respectiveends. A channel region is defined between source and drain regions 32and gate electrode 16 a overlies the channel region (along the topsurface of fin 10 b as well as along the sidewalls of fin 10 b).Likewise, an n-type fin-FET is provided by fin 10 b, which has p-typesource/drain regions 34 formed at either end and a channel regiondefined therebetween. Gate electrode 16 b overlies the channel region(along the top surface of fin 10 b as well as along the sidewalls of fin10 b). For point of reference, FIGS. 1, 2, 3, and 4 a-4 d illustrate thecross-section indicated at line A-A in FIG. 4 e.

Yet another approach to CMOS integration of a strained-fin p-typefin-FET and a strained-fin n-type fin-FET is shown in FIGS. 5 a through5 e, which illustrate a so-called split wafer approach. FIG. 5 aillustrates a silicon wafer 2 in which a deep trench 36 has been formedby anisotropic etching or a combination of isotropic and anisotropicetching. Photoresist material 30 is employed to define the position andsize of the deep trench. Buffer layer 3 and SiGe layer 5 are epitaxiallyand selectively grown on the exposed silicon surfaces of deep trench 36.During the epitaxial growth of buffer layer 3, germanium is graduallyintroduced as a precursor so as to gradually increase the germaniumconcentration of the buffer layer from effectively nil to the nominalconcentration in SiGe layer 5. Epitaxial growth continues with thenominal SiGe concentration, resulting in SiGe layer 5. As will beapparent to one skilled in the art, buffer layer 3 and SiGe layer 5 areillustrated as distinct layers. In practice, however, the interfacebetween these layers may be indistinct or entirely indistinguishable.

FIG. 5 c illustrates the formation and patterning of oxide layer 4 oversubstrate 2, and SiGe layer 5, and nitride layer 6 over oxide layer 4,to form trenches 8. Note that certain trenches expose substrate 2 andother trenches expose SiGe layer 5.

Through appropriate masking and epitaxial growth steps, fins of varyingcomposition can be grown in the respective trenches 8. For instance, asshown in FIG. 5 d, SiGe fins 10 may be grown over substrate 2, whereasSi fins 20 may be grown over SiGe layer 5. One skilled in the art willrecognize that this can be accomplished by masking certain trenches 8,while growing SiGe in the exposed trenches, followed by exposing thepreviously masked trenches 8, masking the SiGe fins, and growing Si inthe exposed trenches. Also shown in FIG. 5 d, by way of illustration,are exemplary SiC fins 40. These fins likewise are grown in trenchesthat are masked when the other fins are formed, and likewise the otherfins are masked while SiC is epitaxially grown in the appropriatetrenches. Obviously, the placement and arrangement of fins 10, 20, and40 in FIG. 5 d is for illustration only. Likewise, the relative size andplacement of buffer layer 3/SiGe layer 5, relative to Si substrate 2 isfor illustration only. In practice, numerous trenches of different sizesand configurations would likely be used. Also, while a SiGe virtualsubstrate formed in a silicon wafer is illustrated, various othermaterials for the wafer and the virtual substrate will be apparent toone skilled in the art.

For completeness, FIG. 5 e illustrates the integrated circuit of FIG. 5d with nitride layer 6 removed and after the formation of respectivegate dielectrics 14 and gate electrodes 16, using the processesdiscussed above with reference to FIGS. 1 through 4.

In yet another illustrative embodiment, a single integrated circuitemploys both body-tied, strained-fin fin-FET devices and planartransistors. As illustrated in FIG. 6, the manufacturing processes for abody-tied, strained-channel multi-channel transistor of the illustrativeembodiments is fully compatible with conventional planar transistor CMOSprocess flows. In one integration scheme, oxide layer 4, which is usedin the fabrication of exemplary multi-gate transistor 42, can beemployed as an oxide liner layer for a planar transistor device 44, oralternatively as at least a portion of an ILD layer for the transistordevice 44. In another embodiment (not shown), oxide layer 4 could serveas the gate oxide for planar device 48. Again numerous features andelements necessary for an actual device are omitted from FIG. 6 in orderto clarify features of the embodiment.

Advantageous embodiments of the invention include a method ofmanufacturing a transistor. The method includes providing a substratehaving a top surface, the top surface having a first lattice constant,forming an insulating layer over said top surface, forming an opening insaid insulating layer to expose a portion of said top surface, andepitaxially growing an extension on said top surface in said opening,the extension having a second lattice constant that is different fromsaid first lattice constant. The method further includes forming a dopedregion in said extension, forming a gate dielectric over at least aportion of said extension, and forming a gate electrode over said gatedielectric. In some embodiments, providing a substrate includesproviding a wafer; forming a buffer layer on said wafer, and forming asemiconductor layer on said buffer layer, the semiconductor layer havingsaid first lattice constant. Forming an insulating layer could includeforming an oxide layer on said top surface and forming a nitride layeron the oxide layer. Forming a doped region in the extension couldinclude ion implanting impurities to form a first source/drain regionand a second source/drain region. Forming a gate dielectric couldinclude oxidizing a portion of said extension. In some embodiments,forming a gate dielectric includes forming a semiconductor layer on aportion of said extension, and oxidizing said semiconductor layer on aportion of said extension.

Another advantageous feature of some embodiments may include a devicecomprising a silicon containing substrate having a first latticeconstant and having a top and a member protruding from the top of thesubstrate and having a second lattice constant, different than the firstlattice constant. The member has a continuous crystalline structurewith-the silicon containing substrate. The device further includes aninsulating material formed atop said top surface of said member, and aconducting material formed atop said insulating material. In someembodiments, a difference between the first and second lattice constantscreates a bi-axial compressive strain in the member. In someembodiments, the bi-axial compressive strain originates at an interfacebetween the top of the substrate and a bottom of the member. The devicemay further include a second member protruding from said top of saidsubstrate and having a third lattice constant, different than the firstand second lattice constant, the second member having a continuouscrystalline structure with-the silicon containing substrate. In someembodiments, the device includes comprising a trench in said substrate,a buffer layer formed in the trench, and a relaxed layer formed on thebuffer layer. In other embodiments, the member comprises Si and thesecond member comprises SiGe or SiC.

Although the present invention and its advantages have been described indetail, it should be understood that various changes, substitutions andalterations can be made herein without departing from the spirit andscope of the invention as defined by the appended claims. Moreover, thescope of the present application is not intended to be limited to theparticular embodiments of the process, machine, manufacture, andcomposition of matter, means, methods and steps described in thespecification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

What is claimed is:
 1. A device comprising: a semiconductor substratehaving a first lattice constant; a semiconductor fin extending directlyand continuously from a top surface of the semiconductor substrate, thehaving a second lattice constant, the second lattice constant beingdifferent from the first lattice constant, the fin having a bottomsurface disposed directly on the top surface of the semiconductorsubstrate, an opposite top surface and two opposed side surfaces,wherein the difference in lattice constants creates a bi-axialcompressive strain in the semiconductor fin at an interface between thetop surface of the semiconductor substrate and the bottom surface of thefin; a gate dielectric covering at least a portion of the top surfaceand the two opposed side surfaces; and a gate electrode covering atleast a portion of the gate dielectric.
 2. The device of claim 1,wherein the semiconductor substrate comprises a relaxed layer having thefirst lattice constant, a wafer layer under the relaxed layer and havinganother lattice constant different than the first lattice constant, anda buffer layer interjacent the relaxed layer and the wafer layer.
 3. Thedevice of claim 2, wherein the relaxed layer comprises SiGe or SiC. 4.The device of claim 1, wherein the semiconductor substrate comprises abulk wafer having a trench formed therein, a buffer layer filling abottom portion of the trench, a relaxed layer filling an upper portionof the trench, and wherein the semiconductor fin extends directly andcontinuously from the relaxed layer.
 5. The device of claim 4, furthercomprising a second semiconductor fin extending directly andcontinuously from a top surface of the bulk wafer.
 6. The device ofclaim 5, wherein the bulk wafer comprises silicon and the relaxed layercomprises SiGe.
 7. The device of claim 6, wherein the semiconductor fincomprises Si and the second fin comprises a material selected from thegroup consisting of SiGe and SiC.
 8. The device of claim 1 furthercomprising an oxide layer overlying the top surface of the semiconductorsubstrate and wherein the oxide layer overlies a source/drain region ofa planar transistor formed on the semiconductor substrate.
 9. Anintegrated circuit comprising: a semiconductor substrate having a topsurface with a first lattice constant; an insulating film disposed onfirst portions of the top surface of the semiconductor substrate; aplurality of islands extending directly and continuously from respectivesecond portions of the top surface, different from the first portions ofthe semiconductor substrate, and forming interfaces between respectivebottoms of the plurality of islands and the second portions of the topsurface, the plurality of islands having a second lattice constant thatis different from the first lattice constant, the plurality of islandsfurther extending above a top surface of the insulating film, whereineach of the islands has a bi-axial compressive strain created at aninterface between the top surface of the semiconductor substrate and abottom surface of the islands; and at least one multi-gate deviceincluding: a gate dielectric disposed on a portion of a top surface ofat least one of the plurality of islands; and a gate electrode overlyingthe gate dielectric.
 10. The integrated circuit of claim 9, furthercomprising: a second plurality of islands extending directly andcontinuously from respective third portions of the top surface,different from the first portions and second portions of thesemiconductor substrate, and forming interfaces between respectivebottoms of the second plurality of islands and the third portions of thetop surface.
 11. The integrated circuit of claim 10, wherein the secondplurality of islands having a third lattice constant that is differentfrom the first lattice constant, the second plurality of islands furtherextending above a top surface of the insulating film, wherein each ofthe second islands has a bi-axial tensile strain created at an interfacebetween the top surface of the semiconductor substrate and a bottomsurface of the second plurality of islands.
 12. The integrated circuitof claim 9, wherein the second portions of the top surface comprise arelaxed semiconductor material formed atop a buffer layer formed in atrench in a bulk semiconductor material wafer.
 13. The integratedcircuit of claim 10, wherein the third portions of the top surfacecomprise a top surface of a bulk semiconductor material wafer.
 14. Theintegrated circuit of claim 10, further comprising a third plurality ofislands extending directly and continuously from respective fourthportions of the top surface, different from the first portions, thesecond portions, and the third portions of the semiconductor substrate,and forming interfaces between respective bottoms of the third pluralityof islands and the fourth portions of the top surface.
 15. Theintegrated circuit of claim 9, further comprising a planar transistorstructure formed in the semiconductor substrate, the insulating filmoverlying a part of the planar transistor.
 16. A method comprising:forming an insulating material over a substrate having a first latticeconstant; exposing portions of the substrate; epitaxially growing a finfrom the substrate, the fin having a second lattice constant, differentthan the first lattice constant, the fin having a continuous crystallinestructure with the substrate; forming an insulating material on a topsurface of the fin; and forming a conducting material atop theinsulating material.
 17. The method of claim 16, further comprisingforming a trench in the substrate, filling a lower portion of the trenchwith a buffer layer, filling an upper portion of the trench with arelaxed layer having the first lattice constant, and epitaxially growingthe fin from the relaxed layer.
 18. The method of claim 16, wherein thestep of device of epitaxially growing a fin from the substrate comprisesgrowing a Si fin from a SiGe substrate.
 19. The method of claim 16,further comprising epitaxially growing a second fin from the substrate,the second fin having a second lattice constant, different than thefirst lattice constant and the second lattice constant, the second finhaving a continuous crystalline structure with the substrate.
 20. Themethod of claim 16, further comprising forming buffer layer over a bulkwafer and forming a relaxed layer formed over the buffer layer, for formthe substrate.